Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
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It is a flexible substrate that allows for a highly reliable connection.
By partially removing the base film, it is possible to form a conductor. By narrowing the pattern width, reliable connections to the opposing circuit or device can be achieved, similar to wire bonding. It is used in areas that require high density and high reliability, such as probes.
Rigid substrates and flexible printed circuit boards are integrated.
It is an FPC that combines a rigid substrate and a flexible printed circuit board.
High through-hole connectivity
This is an FPC that uses polyimide in all layers with a configuration of three or more layers. It can be manufactured up to 10 layers.
Custom-made support for narrow pitch high-definition and ultra-high-definition substrates! Leave flexible substrates (high-definition FPC) to us!
Our company is a specialized manufacturer of circuit boards, celebrating approximately 50 years this year. With our extensive experience and track record in solving various challenges in flexible circuit boards, we can produce high-resolution FPC prototypes in a short lead time, covering everything from cost considerations to prototype manufacturing and mass production. We utilize advanced techniques such as micro-hole processing using chemical etching, BVH connections, and polyimide micro-hole processing technology that allows for simultaneous hole drilling to meet our customers' needs. Please feel free to contact us with your requests. 【Features】 ■ Custom-made high-resolution and ultra-high-resolution boards with narrow pitch ■ Micro-hole processing and BVH connections using chemical etching ■ Introduction of polyimide micro-hole processing technology that allows for simultaneous hole drilling *For more details, please download the PDF or contact us.
The flexible parts can be multilayered, and there are also specifications for the rigid parts that are multilayered or have a build-up structure!
We would like to introduce the "Rigid Flexible Circuit Board" handled by Matsuwa Sangyo Co., Ltd. This board integrates rigid and flexible circuit boards and is also referred to as rigid flex or rigid FPC. Our product not only combines the features of rigid and flexible circuit boards but also eliminates the need for connectors in the interconnection between boards, making it effective for lightweight, compact, and three-dimensional assembly and wiring. 【Example Specifications for Flexible Circuit Board Manufacturing (Excerpt)】 ■ Base Material Thickness: 25μm, 50μm ■ Copper Foil Thickness: 18μm, 35μm ■ Copper Foil Types: Rolled Copper Foil, Special Electrolytic Copper Foil ■ Coverlay Color: Amber ■ Resist Color: Amber, Green, Black, White *For more details, please refer to the related links or feel free to contact us.
It is a flexible substrate effective for high-density wiring. FPC
Unlike conventional through holes, to avoid penetrating the hole, a via is placed directly under the pad. Fine hole processing using lasers is possible, making it effective for ultra-high-density wiring, etc. With the miniaturization and thinning of mobile devices, as well as the enhancement of communication devices, there is an increasing demand for high-density mounting of narrow pitch, multi-pin packages. Consequently, flexible substrates are also advancing in terms of high-layer count and high density. FPC
Turnkey connector implemented! A thin polymer resin film is used as insulation.
"Flexible substrates / Rigid-flexible substrates" are alternatives to conventional wiring connections using wires or ribbon cables. Flexible printed circuits can reduce space and weight while improving reliability. They are made by etching copper-clad materials and using a thin polymer resin film as insulation between the conductor circuit patterns. In electronic device enclosures, turnkey subassemblies may be utilized, incorporating aerospace-grade connectors at the ends for space-saving and lightweight assembly. 【Features】 ■ Single-sided and double-sided flexible substrates ■ Multi-layer and rigid-flexible substrates ■ Electrical and optical flexible substrates ■ Specialized for IPC 6012/6013 Class 3, Types 1 to 4 *For more details, please refer to the PDF materials or feel free to contact us.
Combining PTFE base and low dielectric coverlay to produce various low-loss FPCs!
The "Ultra-Fine Circuit High-Frequency Flexible Substrate" is a flexible substrate designed for high-frequency applications in the GHz range, compatible with bare chip mounting. By using LCP (Liquid Crystal Polymer) with low dielectric properties as the core material and forming circuits using the SAP (Semi-Additive Process), it is possible to create transmission lines with a differential impedance of 100Ω at wiring pitches below 50μm. To accommodate wire bonding with bare chips, the mounting pads are treated with ENEPIG (Electroless Ni Pd Au plating) for surface treatment. One of the features of SAP is its high precision in circuit formation, with an accuracy of ±5μm, making it suitable for impedance control. *For more details, please download the PDF or contact us.*
Flying lead structure
It is an FPC that can make electrical contact from both sides.
Achieving a 40% reduction in thickness! Introducing a flexible, low-rebound, and excellent multilayer flexible substrate.
The "Ultra-thin Flexible Multi-layer FPC" is a multi-layer flexible substrate that achieves a thinner profile while maintaining the same wiring density as standard multi-layer FPCs. It enables bending wiring in narrow spaces, which was previously difficult, contributing to the ongoing lightweight and compact development of digital electronic devices. It can be applied to wearable devices used in various fields, including mobile devices, medical and nursing care, robotics, sports, and healthcare. 【Features】 ■ Achieves a 40% reduction in thickness ■ Uses polyimide as the substrate, ensuring sufficient reliability while being thin ■ Excellent embedability due to its thin, flexible, and low-rebound characteristics *For more details, please refer to the PDF document or feel free to contact us.
![High Current Flexible Circuit Board [*FPC Technology Catalog Available]](https://image.mono.ipros.com/public/product/image/c7d/2000477292/IPROS51770483967615096271.png?w=280&h=280)
Slim shape compatible with high current. Can be curved, suitable for integration into narrow spaces. An alternative to busbars and harnesses.
Our "High Current Flexible Wiring Board" is a product designed for high current wiring, intended as a substitute for busbars and harnesses. By forming a copper foil layer with a conductor thickness of 75 to 90 μm, it is possible to carry higher currents than standard flexible printed wiring boards. The substrate uses polyimide film, and soft resist ink is used as the insulating material, allowing for flexibility, which makes it suitable for installation in tight spaces. 【Features】 ■ Capable of carrying high currents ■ Can be installed and bent in narrow spaces ■ Compatible with through-hole components and surface-mounted components ■ Can integrate connections between substrates, contributing to a reduction in assembly labor *For more details, please refer to the PDF document. Feel free to contact us with any inquiries.
A "trump card" for miniaturization and low profile! Applicable to digital cameras, robots, and more.
We would like to introduce our "Rigid Flexible Circuit Boards." Traditionally, connections were made using B to B connectors, but with the rigid-flex design, both the area and height have been reduced to less than half. These can be applied in fields such as automotive, tablet devices, smartphones, and medical equipment. 【Board Specifications】 ■ 8-layer through-hole board (Rigid Flexible Circuit Board) ■ Board thickness t = 0.7mm ■ Flexible part thickness t = 0.28mm ■ Minimum L/S: 0.1/0.1mm ■ Minimum Via: hole diameter 0.25mm ■ Land diameter surface layer 0.45mm, inner layer 0.5mm *For more details, please download the PDF or feel free to contact us.
